Product Name: Relio R1 HPC+

Manufacturer: Sealevel Systems, Inc.

Product Category: Computing Hardware, Software and Systems

Supporting Documentation (if available)

Relio™ R1 HPC+: High-Performance Edge Computing Platform Built on COM-HPC Architecture
The Relio™ R1 HPC+ is a next-generation rugged embedded computing platform designed to bring true high-performance computing (HPC) capabilities to edge deployments. Built on COM-HPC Mini architecture and powered by the latest Intel® Core™ i5 and i7 industrial processors, the R1 HPC+ addresses the increasing demand for high-bandwidth data processing, real-time analytics, and AI inference at the edge.

Built for design engineers, system integrators, and OEMs, the R1 HPC+ delivers a scalable, modular, and rugged solution capable of supporting advanced workloads in industrial automation, machine vision, robotics, transportation, and defense applications.

High-Performance Processing and Memory Architecture
At the core of the R1 HPC+ is a COM-HPC Mini module leveraging 13th generation Intel® Core™ i5 or i7 processors, enabling significantly higher compute density and throughput compared to COM Express-based systems. The platform supports up to 32GB of DDR5 memory, offering improved bandwidth and efficiency critical for data-intensive applications such as AI inference, sensor fusion, and real-time image processing.

This architecture provides a clear upgrade path for embedded system designers, allowing CPU and memory performance improvements without requiring a full system redesign. The result is a future-ready platform that reduces engineering risk while extending system lifecycle value.

Advanced Networking and Data Throughput
A defining capability of the R1 HPC+ is its high-throughput networking architecture. The system features five 2.5 Gigabit Ethernet ports, enabling simultaneous high-speed data acquisition and distribution across multiple sensors, cameras, or network nodes.

This level of networking density is particularly valuable for:
• Multi-camera machine vision systems
• Autonomous platforms requiring sensor fusion
• Industrial IoT gateways aggregating large data streams
• Distributed control systems requiring low-latency communication

Optional Wi-Fi 6E connectivity further extends deployment flexibility, enabling high-speed wireless communication in edge environments where wired infrastructure is limited or impractical.

AI Acceleration and Expansion Flexibility
The R1 HPC+ is purpose-built to support modern AI and edge workloads through its flexible expansion architecture. The system includes support for multiple high-speed expansion options, including:

• E1.S (PCIe Gen 4) modules for AI acceleration or high-performance storage
• M.2 NVMe (PCIe Gen 4) for internal SSD or accelerator integration
• CFexpress (PCIe Gen 3) for removable storage

This expansion capability allows system designers to integrate AI accelerator modules such as the Unigen Hailo-8, enabling efficient, low-power AI inference directly at the edge.

By supporting both storage and accelerator configurations within the same architecture, the R1 HPC+ enables flexible system design tailored to specific application requirements without increasing system footprint.

Flexible I/O and Peripheral Integration
The R1 HPC+ offers a comprehensive set of modern and legacy I/O interfaces to simplify system integration across diverse environments. Key I/O features include:

• Six locking USB ports (USB 3.1 Gen 2 Type A, USB-C, and USB 2.0)
• Dual DisplayPort outputs (standard and USB-C with DP Alt Mode)
• Isolated serial console via USB-C
• Integrated audio

Sealevel’s SeaLATCH™ locking USB connectors provide secure cable retention, ensuring reliable connectivity in high-vibration or mobile environments.

This combination of high-speed and legacy connectivity enables seamless integration with both modern peripherals and existing industrial infrastructure, reducing integration complexity for engineers.

Rugged Design for Harsh Environments
The R1 HPC+ is designed for deployment in demanding industrial and field environments. The system features a fanless, solid-state architecture housed in an anodized aluminum enclosure, optimized for thermal performance and durability.

Key environmental specifications include:
• Operating temperature range: -40°C to +50°C
• Resistance to shock and vibration
• Wide input power range (9–48 VDC)
• Compact form factor: 8” x 5.75” x 2.4”

This rugged design ensures reliable, continuous operation in environments where traditional commercial computing platforms would fail, including factory floors, mobile systems, and outdoor deployments.

Software Compatibility and Deployment Flexibility
The R1 HPC+ supports a broad range of operating systems, including:
• Windows 10 IoT Enterprise
• Windows 11 IoT Enterprise
• Linux (RHEL 8+, Ubuntu 20.04+)

This flexibility allows engineers to deploy existing software stacks or develop new applications without platform constraints. The system’s compatibility with modern OS environments ensures support for containerization, virtualization, and AI frameworks commonly used in edge computing applications.

Scalable, Future-Proof System Design
COM-HPC architecture represents a significant advancement in embedded system design. Unlike traditional fixed architectures, the modular approach of COM-HPC allows designers to upgrade processing capabilities independently of carrier board and I/O design.

This results in:
• Faster time-to-market for system updates
• Extended product lifecycle
• Improved scalability across product lines
• Reduced redesign costs

For OEMs and system integrators, this translates to a platform that evolves with technology while maintaining consistent mechanical and electrical interfaces.

Engineered for Reliability and Long-Term Deployment
The Relio™ R1 HPC+ is backed by Sealevel Systems’ vertically integrated design and manufacturing model, with all engineering, production, and quality processes managed in-house, in the United States. This approach ensures consistent product quality, traceability, and long-term availability for mission-critical applications.

Sealevel’s adherence to AS9100D and ISO 9001:2015 quality standards further reinforce the platform’s suitability for high-reliability industries, including aerospace, defense, and industrial automation.

Enabling Next-Generation Edge Applications
The Relio™ R1 HPC+ is designed to meet the evolving demands of edge computing, where the increasing volume of data, real-time processing requirements, and AI-driven insights are reshaping system architectures.

By combining high-performance compute, advanced networking, AI acceleration, and rugged reliability in a compact, scalable platform, the R1 HPC+ enables engineers to design and deploy next-generation edge systems with confidence.

From vision systems and autonomous platforms to industrial analytics and high-bandwidth data acquisition, the Relio™ R1 HPC+ delivers the performance, flexibility, and durability required to push edge computing forward.